As the world leader in access floor technology, we understand the important
issues involved with cleanroom floor design issues facing the industry.
These include: footfall and traffic vibration as well as potential seismic
events, heavy rolling loads in the form of 300mm wafer processing tools,
electrical static build-up that can short out sensitive circuits, airflow
distribution and volume vs. energy considerations, and dealing with ever
smaller particulate and gaseous airborne contamination challenges. Our
engineering, technical support, and experienced manufacturing expertise
provide worldwide solutions to these ever changing problems within
microelectronics industry, from Class 1 through Class 100 to meet Federal
As the line widths of semiconductor circuits have continued to decrease, how
to deal with airborne particulates that can short out these delicate
communication pathways has become an increasingly greater challenge.
Environments that once were acceptable with the presence of 1 micron or even
.05 micron particles, can no longer tolerate even sub-micron contamination
in gaseous form. Specialized enhancement in access floor product design, as
well as various high-tech coatings and surface finishes, help to minimize
the release of small airborne particulates and out-gassing, which can damage
expensive semiconductor products.
Build Clean Requirements
Tate has the unique capability to package your flooring components within a
clean environment using non-out-gassing packaging material. In addition,
Pugliese's installation crews wear industry approved clean garments, and are
trained to install flooring within an ultra-clean protocol environment using
specially encased tools.
Airflow patterns and velocity still remain a critical element in the
efficient design of effective sub-micron semiconductor cleanrooms. Tate
airflow panels are available using either a traditional 25% open perforated
hole design or 60% open grates, with optional dampers to balance air
distribution within a room as necessary. Extensive real world research and
testing has resulted in a broad range of airflow panel design options, such
as chamfered holes that eliminate air turbulence and reduce "whistling"
Rolling Load Issues
With some semiconductor processing tools approaching 30,000 lbs. or more, it
is essential that the access floor be able to handle the massive rolling
loads they are exposed to when these machines are moved in and out of the
fabs. The Tate Floating's Floor FF3000 die caste aluminum flooring system,
with ultimate loads up to 4,500/sq. in., has been uniquely designed to meet
these excessively heavy pieces of equipment.
The potential static build-up of electricity on fab workers is the mortal
enemy of the semiconductor, allowing electrical surges to short out the
delicate multi-layered circuitry within the transistors. The remedy is the
various conductive surface finishes available on both solid and perforated
access floor panels, as well as specialty coatings and platings for the
grates...not to mention the first line of defense of the naturally
conductive aluminum floor and understructure itself!